Laser Machining Services
AdValue Technology offers laser machining services on various hard and brittle materials such as sapphire, glass, ceramics and silicon substrates, especially when it is too thin to be machined by mechanical process. If you need any of the following machining on those materials, we are here to help:
- Precision cutting;
With advanced ultrashort pulse laser equipment, we are able to offer superior machining quality with high precision, small chips and fast turnaround.
|Materials||Sapphire, Quartz, Glass, Ceramics, Silicon and Others|
|Processing area||10cm x 10cm|
|Machined hole diameter||80μm ~ 5cm|
|Machined area||Hole, oval, star, rectangle, et al, almost any configurations|
|Machined thickness||10μm ~ 6mm|
Figure 1. Optical microscopy images of millimeter diameter holes drilled by ultrashort pulse lasers on sapphire, fused quartz, borosilicate glass, and Al2O3 ceramic substrates.
Figure 2. Fused quartz discs OD20mm*T1.5mm with 55 Dia0.25mm holes, tolerance <20µm, chip <100µm or <20µm
Figure 3. Sapphire wafer with 0.3mm thickness. 109 round Ø2.9mm blind slots with depth 0.15mm, chip < 20µm.
We are happy to hear your application and how we may help you achieve your goal. Welcome to contact us at email@example.com for further discussion.