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A range of conductor pastes are available for contacting resistors and applying conductor lines on aluminum nitride (AlN) substrates. Each paste offers distinct properties, such as electrical conductivity, solderability, leaching resistance and adhesion. This diverse selection enables our customers to choose the ideal paste tailored to their specific application requirements.
Thick films produced using FK1071, an AgPt conductor paste, are characterized by their low film resistance and good solderability. This paste enables the formation of thick-film conductors for AlN with a low resistance.
With FK1205, a conductor paste with AgPd contained in a 3:1 ratio, the fired films provide excellent leaching resistance and solderability. FK1205 can be used as a conductor paste for the FK9600 and FK9900M paste systems.
The fired films of FK1282, an AgPt conductor paste, are characterized by excellent leaching resistance and solderability.
With FK1572, an Ag conductor paste, it is possible to cost-efficiently produce films with very low surface resistance below 3.5 mOhm/Sq.
The fired films of FK1574, an AgPtPd conductor paste, provide excellent leaching resistance and solderability, in particular with regard to lead- free solder
With FK1916, a conductor paste with AgPd contained in a 6:1 ratio, it is possible to produce films with high solderability, leaching resistance and adhesion. The paste can be used as a conductor paste for the FK9600 and FK9900M paste systems.
The fired films of FK1953, a conductor paste with an AgPd ratio of a 3:1, provide excellent leaching resistance and solderability. The paste is the RoHS II and REACH compliant successor of FK1220 and is a suitable conductor paste for the FK9600 and FK9900M resistor paste system.
The copper paste FK3101 can be used on Al2 O3 and pre-oxidized AlN substrates, as well as on non- pre-oxidized AlN ceramics which have previously been thinly metalized with FK3201, in order to produce films with up to 300 µm height.
The copper paste FK3201 is suitable for application on Al2 O3, as well as on non- pre- oxidized AlN ceramics.
| Characteristics | Unit | FK1572 | FK1071 | FK1916 | FK1205 | FK1953 | FK1282 | FK1574 | FK3101 | FK3201 |
|---|---|---|---|---|---|---|---|---|---|---|
| Material | -- | Ag | AgPt | AgPd | AgPd | AgPd | AgPt | AgPtPd | Cu | Cu |
| Alloy ratio | -- | -- | 97:3 | 6:1 | 3:1 | 3:1 | 3:1 | 13:3:1 | -- | -- |
| Viscosity | Pa·S | 140...220 | 320…450 | 180…350 | 180…350 | 150…350 | 180…350 | 180…350 | TBD | TBD |
| Sheet resistance | mOhm/Sq | ≤3.5 | ≤6 | ≤15 | ≤25 | ≤25 | ≤35 | ≤60 | TBD | TBD |
| Solderability | % | -- | ≥95 | ≥95 | ≥98 | ≥90 | ≥95 | ≥90 | ≥90 | ≥90 |
| Leaching resistance | Dips/result | -- | ≥3 | ≥3 | ≥3 | ≥3 | excellent | excellent | TBD | TBD |
| Adhesion(number offirings) | ||||||||||
| -Initial(1X) | N/4mm² | -- | ≥16 | ≥18 | ≥18 | ≥22 | ≥22 | ≥22 | TBD | TBD |
| -Aged(1X) | -- | ≥16 | ≥18 | ≥18 | ≥22 | ≥22 | ≥22 | TBD | TBD | |
| -Initial(3X) | -- | ≥22 | ≥22 | ≥30 | ≥20 | ≥27 | -- | -- | ||
| -Aged(3X) | -- | ≥16 | ≥16 | ≥21 | ≥18 | ≥19 | -- | -- | ||
| Fired film thickness | µm | 15±1 | 15±1 | 15±1 | 15±1 | 15±1 | 15±1 | 15±1 | 90±1 | 15±1 |
| Coverage | cm²/g | 65±5 | 61±5 | 70±5 | 71±5 | 63±5 | 58±5 | 58±5 | 15±5 | 47±5 |
—from Fraunhofer IKTS
The achievable film properties depend heavily on the processing conditions – including firing profile, solder materials, soldering conditions, etc. These conditions are detailed in the respective paste specification sheets and must be strictly. Deviations from these recommended guidelines can lead to variations in film performance.
