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At AdValue Technology, we offer high quality diamond substrates which excel in the most demanding applications – from precision tools to cutting-edge electronics.

With a unique combination of mechanical strength, thermal properties, and electrical performance, our diamond substrates are engineered to meet the rigorous standards of today’s most advanced industries.

Key Features of Diamond Substrates

  • Extreme Hardness – Hardest material known, providing unmatched wear resistance
  • Highest Thermal Conductivity of any material – Over 10 x higher than copper, ensuring superior heat dissipation
  • High Electrical Insulation – Ideal for high-voltage and high-frequency applications
  • Wide Bandgap (~5.5 eV) – Significantly higher than silicon or gallium nitride
  • High Breakdown Voltage – Suitable for high-power, high-temperature devices
  • Extremely Low Thermal Expansion – Enhances dimensional stability
  • Wide Optical Transmission – from UV to IR
  • Strong Chemical Inertness – Resistant to most acids, bases, and solvents
  • High Radiation Resistance – Maintains performance in extreme environments

The unmatched properties make diamond substrates ideal for high-performance electronics, thermal management systems, optical applications, and radiation detection.

Material Performance Comparison

Thermal Conductivity W/(m∙K)
Moh’s Hardness
Thermal Expansion Coefficient (106/K)
Silicon Carbide
490
9.5
4.5
Cu
400
3
18
Diamond
1800-2000
10
1

Available Diamond Substrates

1. Diamond Substrates for Heat Spreaders

Diamond’s exceptional thermal conductivity and extremely low thermal expansion make it the ideal material for advanced heat spreader applications.

TypeSingle Crystal (HPHT/CVD)
Thermal conductivity>2000 W/m K
Size Available0.15*0.15~25*25 mm
Thickness0.1~1.0 mm
Tolerance+/-0.05 mm
Face Orientation(100)/(111)
Off Angle<1°
RoughnessRa<1 nm
Coefficient of Thermal Expansion at 25°C1.0*10-6/°C
TypePolycrystalline
Thermal conductivity>1500W/m K
Size Available0~75 mm
Thickness0.2~2.0 mm
Tolerance+/-0.05 mm
RoughnessRa<10 nm
Coefficient of Thermal Expansion at 25°C1.0*10-6/°C
Thermal conductivity>700W/m K
Size Available0~57 mm
Thickness0~5.0 mm
Tolerance+/-0.05 mm
RoughnessRa<50 nm
Coefficient of Thermal Expansion at 25°C2.0~2.2.0*10-6/°C
ConductivityConductive

2. Diamond Substrates for Windows

Diamond windows offer superior heat dissipation and greater bandwidth compared to traditional materials like sapphire and Boron Nitride. They enable longer part life, lower energy loss and lighter designs.

TypeSingle Crystal/Polycrystalline
Size Available0~25 mm/75 mm
Thickness0.1~2.0 mm
Spectral Transparency>70% (225 nm to Far IR)
Refractive Index2.38 (IR range)
Dielectric Constant5.7
Loss Tangent<5*10-5
RoughnessRa<10 nm
Thermal Conductivity>2000/>1500 W/(m·K)
Type220 GHz, 340 GHz, 660 GHz, 850 GHz, etc.
Size AvailableDia 0.5 mm~25 mm
S ParameterS21 ≥-1.5 dB, S11 ≤-15 dB @220 GHz
Bandwidth≥20 GHz @220 GHz
Vacuum Degree<1*10-10 Pa/m3-s
Dielectric Constant5.7
Loss Tangent<5*10-5
Thermal Conductivity>2000 W/(m·K)

3. Diamond Products for Semiconductor

Diamond single crystals are ideal for semiconductor, detector, and quantum sensing technologies due to diamond’s many unique advantages, including wide bandgap, high electron saturation velocity, large carrier mobility, low dielectric constant, and exceptional radiation resistance.

TypeHPHTCVD
Size0.15*0.15~25*25 mm (100) 0.15*0.15~15*15 mm (111)0.15~0.15 ~ 22*22 mm
Thickness0.06~1.0 mm0.06~1.0 mm
Off Angle(100)/(111) +/-1°(100)/(111) +/-1°
Roughness<1 nm<1 nm
FWHM<50 arcsec<120 arcsec
TTV<30 µm<30 µm
WARP<10 µm<10 µm

Enhance your next-generation devices with the power of diamond technology.

Contact us today to discuss your application and request a quote.

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Have Questions? We’re Ready to Help!

Whether you’re within or outside the U.S., our expert team is ready to assist you with any product or technical inquiries. Explore our wide selection of materials for high temperature, high purity and abrasive applications. 
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