Via Filling Paste
The via filling paste was developed for use on AlN and Al2O3 substrates.
FK1105
The AgPt via filling paste FK1105 is specified for use on “AN180” AlN substrates, by CoorsTek (formerly ANCeram), and “Rubalit 7085” Al2O3 substrates, by CeramTec. Substrates with other surface qualities or from other manufactures may lead to variations in the results. The paste exhibits very little sinter shrinkage in order to fill the via as completely as possible. This helps to establish contact between buried and surface metallization of multi-layer ceramics.
Stencil printing
The paste can be used for the metallization of vias in aluminum nitride and alumina. To fill the vias as fully as possible, stainless steel stencils should be used which are adapted to fit the thickness of the substrates. With regard to the via openings in the stencils, Fraunhofer IKTS recommends making the opening approx. One to five percent wider than the via diameters introduced in the ceramics.
Technical specifications
| Characteristics | Unit | FK1105 |
|---|---|---|
| Material | -- | AgPt |
| Viscosity | Pa·S | TBD |
| Sheet resistance | mOhm/Sq | ≤10 |
| Solderability | % | TBD |
| Leaching resistance | Dips | TBD |
| Adhesion(number offirings) | ||
| -Initial(1X) | N/4mm² | TBD |
| -Aged(1X) | TBD | |
| Fired film thickness | µm | 15±1 |
| Coverage | cm²/g | 63±5 |
