Boron Nitride Product BN-B grade

Boron Nitride Product BN-B grade

Grade BN-B
Chemical Structure (BN%) % 99
Other Components no
Density g/cm3 2.15
Hardness HL 450
Flexural Strength Mpa 95
Coefficient of Thermal Expansion (25°C ~ 1200°C) (10-6/K) 1~2
Thermal Conductivity at 20°C W/mk 35
MAX-Temperature of use Oxidizing 900°C
Vacuum 1600°C
Inert 1800°C
RT Resistivity Ω.cm >1014


BN-B grade products are made of high purity Boron Nitride powders without any binder. The products feature high density, low thermal expansion and high thermal conductivity, and are especially suitable for semiconductor and microelectronics equipment parts.

Typical Applications

  1. Boron nitride parts for ion implanters
  2. Boron nitride insulation spacer and sealing element for high-temperature equipment
  3. Boron nitride parts for vacuum metalized machines
  4. Boron nitride nozzles for powder metal atomization