| Grade | BN-B | |
|---|---|---|
| Chemical Structure (BN%) | % | 99 |
| Other Components | no | |
| Density | g/cm3 | 2.15 |
| Hardness | HL | 450 |
| Flexural Strength | Mpa | 95 |
| Coefficient of Thermal Expansion (25ยฐC ~ 1200ยฐC) | (10-6/K) | 1~2 |
| Thermal Conductivity at 20ยฐC | W/mk | 35 |
| MAX-Temperature of use | Oxidizing | 900ยฐC |
| Vacuum | 1600ยฐC | |
| Inert | 1800ยฐC | |
| RT Resistivity | ฮฉ.cm | >1014 |
BN-B grade products are made of high purity Boron Nitride powders without any binder. The products feature high density, low thermal expansion and high thermal conductivity, and are especially suitable for semiconductor and microelectronics equipment parts.