| Grade | BN-B | |
|---|---|---|
| Chemical Structure (BN%) | % | 99 |
| Other Components | no | |
| Density | g/cm3 | 2.15 |
| Hardness | HL | 450 |
| Flexural Strength | Mpa | 95 |
| Coefficient of Thermal Expansion (25°C ~ 1200°C) | (10-6/K) | 1~2 |
| Thermal Conductivity at 20°C | W/mk | 35 |
| MAX-Temperature of use | Oxidizing | 900°C |
| Vacuum | 1600°C | |
| Inert | 1800°C | |
| RT Resistivity | Ω.cm | >1014 |
BN-B grade products are made of high purity Boron Nitride powders without any binder. The products feature high density, low thermal expansion and high thermal conductivity, and are especially suitable for semiconductor and microelectronics equipment parts.
